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Electronic Device Failure Analysis (EDFA)

Electronic Device Failure Analysis™ (EDFA™) is a high demand quarterly technical resource for the modern failure analysis professional. Published in both print and digital versions, each issue covers:

  • Contributed technical articles that cover everything from operations to techniques
  • Insight into trends in the microelectronics FA industry, to keep you up-to-date
  • New product announcements
  • Recognition of outstanding contributions to the field of FA
  • Looking to update some skills?  The Training Calendar provides an easy way to know what courses are coming up in the months ahead.
  • News of the Electronic Device Failure Analysis Society.
  • Guest Columns provide that vital perspective into other FA

All EDFAS members receive free access to the EDFA Magazine Digital Edition and EDFA Technical Articles as a membership benefit.

If you’d like to purchase a subscription to EDFA magazine, please contact us at [email protected] or by phone at 440.462.0292. 

EDFA Author Guidelines (pdf)

EDFA Guest Editorial & Columnist Guidelines (pdf)

EDFA Sample Article (pdf)

Interested in advertising in EDFAS Magazine? There are many opportunities available! View our Media Kit to learn more about these advertising opportunities, or contact Kelly “KJ” Johanns, ASM Business Development Manager. 

 


EDFA Editorial Board

Nicholas Antoniou, KLA, Milpitas, CA, USA
Felix Beaudoin, Immediate Past Chair, GlobalFoundries, Malta, NY, USA
Navid Asadi, University of Florida, Gainesville, FL, USA
Guillaume Bascoul, CNES-French Space Agency, Toulouse, France
Mike Bruce, Past Chair, Independent Consultant, Austin, TX, USA
Jiann Min Chin, AMD Singapore, Singapore
Michael DiBattista, Varioscale Inc., San Marcos, CA, USA
Rosine Coq Germanicus, Universite de Caen Normandie, France
Szu Huat Goh, Qualcomm, Singapore
Jason Holm, NIST, Boulder, CO, USA
Ted Kolasa, Northrop Grumman Space Systems, Scottsdale, AZ, USA
Joy Liao, NVIDIA, San Jose, CA, USA
Rose Ring, Past Chair, NenoVision, Czech Republic
Tom Schamp, E-Space, Dallas, TX, USA
David Su, Yi-Xiang Investment Company, Hsinchu City, Taiwan
Martin Versen, University of Applied Sciences Rosenheim, Germany
Joanne Miller, Senior Editor, ASM International, Materials Park, OH, USA
Vicki Burt, Managing Editor and ASM Staff Liaison, ASM International, Materials Park, OH, USA

EDFA Founding Editors

Ed Cole, Sandia National Laboratories, Albuquerque, NM, USA
Larry Wagner, LWSN Consulting, Plano, TX, USA

Electronic Device Failure Analysis, Volume 28, Issue 1, February 2026
The February 2026 issue of Electronic Device Failure Analysis includes: A Step Toward Automation in Failure Analysis; Advanced FA using In-Situ AFM in FIB-SEM; Enhancing Soft Defect Localization; Highlights from ISTFA 2025; and more.
Electronic Device Failure Analysis, Volume 27, Issue 4, November 2025
The November 2025 issue of Electronic Device Failure Analysis includes: Chiplet Architectures for Scalable Integration; Thermal Approaches to Fault Isolation in 3D Structures; Avoiding Device Degradation through Nanoprobing; Failure Analysis Chatbot with Retrieval-Augmented Generation; and more.
Electronic Device Failure Analysis, Volume 27, Issue 3, August 2025
The August 2025 issue of Electronic Device Failure Analysis includes: Electrical Resistivity and Residual Stress in Sputtered ITO Films; CAD Methods for Cross-Domain FA in Advanced SIP Architectures; Characterization of Yield-Killing Defects in Micro-LED Wafers; Systematically Defocusing the Ion Beam for FIB Workflows; and more.
Electronic Device Failure Analysis, Volume 27, Issue 2, May 2025
The May 2025 issue of Electronic Device Failure Analysis includes: Background and History of the U.S. Chips Act; Silicon Photonic FA using Near Infrared Microscopy; An Ion Microscope for Imaging and SIMS Nanoanalytics; Solder Joints under Varying Temperatures and Salinities; and more.
Electronic Device Failure Analysis, Volume 27, Issue 1, February 2025
The February 2025 issue of Electronic Device Failure Analysis includes: Backside Delayering of 10 nm Node Integrated Circuits; Low Frequency Noise Spectroscopy; Quantum Diamond Microscopy for Failure Analysis; Highlights from ISTFA 2024; and more.
Electronic Device Failure Analysis, Volume 26, Issue 4, November 2024
The November 2024 issue of Electronic Device Failure Analysis includes: Celebrating 50 Years of ISTFA; Four-dimensional Scanning Transmission Electron Microscopy: Part III, Ptychography; Nondestructive 3D X-ray Microscopy Speeds Throughput; Specimen Thinning by Argon Ion Beam Milling; TEM Samples with PFIB and STEM EBIC; and more.
Electronic Device Failure Analysis, Volume 26, Issue 3, August 2024
The August 2024 issue of Electronic Device Failure Analysis includes: Defect Detection of BGA Solder using Deep Learning, Advanced IC Packages for X-ray Inspection, Wire Bonding in Power Microelectronic Devices, 50th Anniversary: ISTFA 2024 Preview, and more.
Electronic Device Failure Analysis, Volume 26, Issue 2, May 2024
The May 2024 issue of Electronic Device Failure Analysis includes: SThM for Localizing and Monitoring Defects, MicroStructural Hierarchy Descriptor for MFA, Electro-Thermal Simulation and Reliability of a BGA, and Differential Laser Voltage Probe Overview.
Electronic Device Failure Analysis, Volume 26, Issue 1, February 2024
The February 2024 issue of Electronic Device Failure Analysis includes: Four-Dimensional STEM: Part II: Applications; Advanced Characterization using Atom Probe Tomography; Thinning and Polishing Highly Warped Die: Part III; ISTFA Wrap Up; and Panel & User Group Summary.
Electronic Device Failure Analysis, Volume 25, Issue 4, November 2023
November 2023 Issue of Electronic Device Failure Analysis, a quarterly publication providing a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers.