EDFA Magazine
Volume 26, Issue 3, August 2024
The August 2024 issue of Electronic Device Failure Analysis includes: Defect Detection of BGA Solder using Deep Learning, Advanced IC Packages for X-ray Inspection, Wire Bonding in Power Microelectronic Devices, 50th Anniversary: ISTFA 2024 Preview, and more.
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Recent past editions
Volume 28, Issue 1, February 2026
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Volume 27, Issue 4, November 2025
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Volume 27, Issue 3, August 2025
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Volume 27, Issue 2, May 2025
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