EDFA Magazine
Volume 27, Issue 4, November 2025
The November 2025 issue of Electronic Device Failure Analysis includes: Chiplet Architectures for Scalable Integration; Thermal Approaches to Fault Isolation in 3D Structures; Avoiding Device Degradation through Nanoprobing; Failure Analysis Chatbot with Retrieval-Augmented Generation; and more.
SUBSCRIBE TO THE AM&P PRINT EDITION
US members receive a year's subscription to the print edition free with their membership. International members pay a $30 shipping charge per year.
Recent past editions
Volume 28, Issue 1, February 2026
Magazine (Global)
Volume 27, Issue 3, August 2025
Magazine (Global)
Volume 27, Issue 2, May 2025
Magazine (Global)
Volume 27, Issue 1, February 2025
Magazine (Global)