EDFA Magazine
Volume 27, Issue 1, February 2025
The February 2025 issue of Electronic Device Failure Analysis includes: Backside Delayering of 10 nm Node Integrated Circuits; Low Frequency Noise Spectroscopy; Quantum Diamond Microscopy for Failure Analysis; Highlights from ISTFA 2024; and more.
SUBSCRIBE TO THE AM&P PRINT EDITION
US members receive a year's subscription to the print edition free with their membership. International members pay a $30 shipping charge per year.
Recent past editions

Volume 28, Issue 1, February 2026
Magazine (Global)

Volume 27, Issue 4, November 2025
Magazine (Global)

Volume 27, Issue 3, August 2025
Magazine (Global)

Volume 27, Issue 2, May 2025
Magazine (Global)

