EDFA Magazine
Volume 26, Issue 1, February 2024
The February 2024 issue of Electronic Device Failure Analysis includes: Four-Dimensional STEM: Part II: Applications; Advanced Characterization using Atom Probe Tomography; Thinning and Polishing Highly Warped Die: Part III; ISTFA Wrap Up; and Panel & User Group Summary.
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Recent past editions
Volume 28, Issue 1, February 2026
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Volume 27, Issue 4, November 2025
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Volume 27, Issue 3, August 2025
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Volume 27, Issue 2, May 2025
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