Stacking up: A new take on diamond electronics

Published: February 20, 2026

Researchers at the U.S. Department of Energy’s Argonne National Laboratory have overcome a critical barrier in diamond-based electronics and microelectronics by using nanotechnology to integrate two-dimensional materials for efficient n-type doping, a breakthrough in electronic materials designed to operate in high-temperature environments and other harsh environments.

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Texas awards $4.16M semiconductor innovation grant to Arm Inc. for major Austin expansion

Published: February 20, 2026

Governor Greg Abbott announced that a Texas Semiconductor Innovation Fund grant of $4,162,550 has been extended to Arm Inc. for an expansion of their Austin campus to include a new semiconductor lab with failure analysis capabilities.

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Researchers develop 3D imaging method for mapping electrical behavior in perovskite films

Published: February 20, 2026

Researchers at several Chinese institutions, led by the Chinese Academy of Sciences, have developed a 3D electrical imaging technique that enables direct observation of how charge moves through perovskite films.

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Synopsys and AMD honored by World Economic Forum for generative and agentic AI vision, leadership, and impact

Published: February 20, 2026

Synopsys, in collaboration with AMD, has been selected for the World Economic Forum’s MINDS (Meaningful, Intelligent, Novel, Deployable Solutions) AI program for their joint work in transforming chip design through AI-powered workflows.

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Novel AI method sharpens 3D x-ray vision

Published: February 20, 2026

Researchers at Brookhaven National Laboratory have developed a new X-ray tomography method called the perception fused iterative tomography reconstruction engine (PFITRE), a novel approach that combines the physics of X-rays with the power of artificial intelligence (AI).

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AI data centers are overheating traditional cooling models

Published: February 20, 2026

Rising power densities in AI data centers are forcing a shift to liquid cooling and service-based models, sparking debate over outsourcing versus addressing core infrastructure and maintenance.

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Advantest and Tokyo Seimitsu announce joint development of die-level prober

Published: January 15, 2026

Advantest Corporation, Japan, and Tokyo Seimitsu Co., Ltd. announce plans to co-develop a new die-level prober, designed for the testing of high-performance computing devices.

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Detecting ‘hidden defects’ that degrade semiconductor performance with 1,000X higher sensitivity

Published: January 15, 2026

A joint research team at the Korea Advanced Institute of Science and Technology and IBM T. J. Watson Research Center, Yorktown Heights, N.Y., has developed a new analysis method that can detect “hidden defects” in semiconductors, electronic traps that interfere with electrical flow, with approximately 1,000 times higher sensitivity than existing techniques.

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New sensor measures strain, strain rate, and temperature with single material layer

Published: January 15, 2026

Researchers from the Institute of Metal Research of the Chinese Academy of Sciences have developed an innovative flexible sensor that can simultaneously detect strain, strain rate, and temperature using a single active material layer, representing a significant advance in multimodal sensing technology.

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New nanoprobing platform for high voltage applications

Published: January 15, 2026

Imina Technologies SA, Switzerland, released a new Nanoprobing High-Voltage Platform designed to safely apply voltages up to 1 kV through both nanoprobing tips and the backside of the sample, addressing the growing need for reliable electrical characterization of wide-bandgap and high-power semiconductor devices such as SiC- and GaN-based MOSFETs, IGBTs, and other devices.

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