Park XE15 atomic force microscope enables automatic imaging of up to nine samples

Published: January 20, 2014

Park Systems, Santa Clara, Calif., announces the debut of Park XE15, a powerfully versatile atomic force microscope featuring a unique MultiSample scan.

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Asylum Research announces the Fourth Euro AFM Forum

Published: January 20, 2014

Asylum Research, Santa Barbara, Calif., an Oxford Instruments company, in conjunction with Georg-August Universität Göttingen, Germany, announces the fourth Euro AFM Forum to be held March 17-19, 2014.

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Time-dependent spectroscopy enables monitoring microscopic samples

Published: January 20, 2014

Craic Technologies, San Dimas, Calif., introduces Craic TimePro kinetic spectroscopy software. It is designed to be used with Craic Technology's microspectrophotometers and their controlling Lambdafire software.

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Multiple memory chips connected in shingle-stack configuration with ultra-short wirebonds

Published: January 20, 2014

Invensas Corp., San Jose, Calif., announces its latest xFD products solutions. The xFD technology connects multiple memory chips in a face-down shingle-stack configuration using ultra-short wirebonds.

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Prof. Zi-Kui Liu, FASM, Receives 2014 J. Willard Gibbs Phase Equilibria Award

Published: January 09, 2014

ASM is pleased to announce that Zi-Kui Liu, FASM, Professor of Materials Science and Engineering, The Pennsylvania State University, University Park, is the 2014 J. Williard Gibbs Phase Equilibria Award recipient.

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ISTFA 2013 Tools of the Trade: RKD/Left Coast Instruments

Published: December 04, 2013

  The history and process of dual acid decapsulation. This includes basic decapsulation techniques and the correct use of electrostatically dissipative tweezers and proper grounding relative to the Elite Etch Cu ESD decpasulation equipment.

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Applied Materials and Tokyo Electron to merge

Published: December 04, 2013

Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., Japan, announce a definitive agreement to merge into a new company whose name has not been released. This combination brings together complementary leading technologies and products to create an expanded set of capabilities in precision materials engineering and patterning. The companies expect the transaction to close in mid to second half of 2014.

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