Predicting new forms of insulating materials

Published: February 07, 2014

Topological insulators have been of great interest to physicists in recent years because of unusual properties that may provide insights into quantum physics.

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ASM International debuts revamped website

Published: February 06, 2014

ASM International, Materials Park, Ohio, recently rolled out a major redesign of their company website.

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Scanning Microwave Impedance Microscopy for nanoscale mapping of permittivity and conductivity

Published: January 21, 2014

Asylum Research, Santa Barbara, Calif., an Oxford Instruments company, has developed Scanning Microwave Impedance Microscopy (sMIM), an atomic force microscopy technique that enables nanoscale mapping of permittivity and conductivity.

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Instrument measures silicon wafer thickness and TSV depths prior to grinding

Published: January 21, 2014

Lasertec U.S.A., San Jose, Calif., introduces the WASAVI Series BGM300. This instrument measures silicon wafer thicknesses and TSV depths prior to back grinding 3D semiconductor devices.

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Bruker stylus profiler enables 300-mm wafer analysis

Published: January 21, 2014

Bruker Nanosurfaces Division, Billerica, Mass., introduces the Dektak XTL Stylus Profiler, extending its stylus profilometry capabilities to 200 and 300 mm semiconductor wafer fabs and next-generation touch panel manufacturers.

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Industry consortium to develop secure semiconductors and systems

Published: January 21, 2014

Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., has launched a new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).

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Cadence Incisive 13.2 verification platform enables faster performance

Published: January 21, 2014

Cadence Design Systems, Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.

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Imec celebrates 30 years of nanoelectronics industry innovation

Published: January 21, 2014

Imec, Belgium, celebrates its 30th anniversary. Founded in 1984 as a non-profit organization, it has enabled notable advancements in global semiconductor chip manufacturing in the three decades since its founding.

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Soliciting EDFAS Board Nominations

Published: January 21, 2014

EDFAS is soliciting nominations for candidates for the EDFAS Board of Directors (BOD). Terms are for four years, beginning September 1, 2014 and ending August 31, 2018. All potential candidates for the BOD must be members in good standing of EDFAS at the time of their candidacy.

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Micromeritics 3Flex surface characterization analyzer enables multiple analyses

Published: January 21, 2014

Micromeritics Instrument Corp., Norcross, Ga., introduces the 3Flex Surface Characterization Analyzer.

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