Scientists create world’s first chip that combines 2D materials with conventional silicon circuitry

Published: October 17, 2025

For the first time, scientists have created a fully functional memory chip only a few atoms thick and integrated it into conventional chips, an advance from Fudan University in China that could pave the way for more powerful and energy-efficient electronic devices.

News, Magazine & Media / Industry News

Oxford Instruments launched witec360 Raman microscope with Hexalight spectrometer

Published: October 17, 2025

Oxford Instruments’ Raman imaging team in England announced a refreshed core microscope line and a groundbreaking new spectrometer, Hexalight, which together with the witec360 microscope constitute the most advanced confocal Raman imaging system yet devised.

News, Magazine & Media / Industry News

Siemens unveils groundbreaking Tessent Analogtest software for automated analog circuit test generation

Published: October 17, 2025

Siemens Digital Industries Software, Plano, Texas, introduced Tessent AnalogTest software - an innovative solution that reduces pattern generation time for analog circuit tests from months to days, enabling testing of analog circuitry in integrated circuits up to 100 times faster than traditional manual methods.

News, Magazine & Media / Industry News

Tektronix introduces 7 Series DPO, setting a new benchmark in ultra-high-performance test and measurement

Published: October 17, 2025

Tektronix, Beaverton, Ore., announced the 7 Series DPO oscilloscope, the first in a new generation of ultra-high-performance instruments, purpose-built for engineering teams and researchers pushing the boundaries of high-speed communications, high-energy physics, AI, and quantum computing.

News, Magazine & Media / Industry News

A prototype LED as thin as wallpaper that glows like the sun

Published: October 17, 2025

Chinese researchers at Hefei University of Technology have created a paper-thin LED that gives off a warm, sun-like glow and could light up the next generation of phone and computer screens and other light sources.

News, Magazine & Media / Industry News

The world’s fastest microscope makes its debut

Published: September 18, 2025

Researchers at the University of Arizona in Tucson have developed a laser-based microscope that snaps images at attosecond — or a billionth of a billionth of a second — speed.

News, Magazine & Media / Industry News

Purdue’s Chipshub wins NSF award for Chip Design Hub to help ease urgent national semiconductor workforce shortage

Published: September 18, 2025

The U.S. National Science Foundation has selected Purdue Engineering-led Chipshub, West Lafayettes, Ind., as its Chip Design Hub by providing a $7 million grant over five years.

News, Magazine & Media / Industry News

Solid-state batteries get a boost with new protective coating

Published: September 18, 2025

Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Lemont, Ill., have developed a method to coat sulfide-based solid electrolytes, finding a thin, glass-like layer could be the key to longer-lasting, cost-effective solid-state batteries.

News, Magazine & Media / Industry News

Lam Research introduces VECTOR TEOS 3D to address critical advanced packaging challenges in chipmaking

Published: September 18, 2025

The new inter-die gapfill tool from Lam Research Corp., Fremont, Calif., expands industry-leading portfolio of solutions for 3D integration and chiplet technologies; paves way for new, AI-accelerating architectures.

News, Magazine & Media / Industry News

The “soft side” of chips: NIST advances polymer science for semiconductor packaging

Published: September 18, 2025

A new perspective article from NIST and collaborators highlights a critical but often underrated piece of the semiconductor revolution: the “soft” polymer-based packaging materials that hold advanced chips together that are emerging as important factors for reliability, performance, and cost.

News, Magazine & Media / Industry News