Modular microscope enables fast substrate thickness measurement

Published: February 24, 2014

UltraTec Manufacturing Inc., Santa Ana, Calif., offers the ICis modular microscope, which allows for fast substrate thickness measurements of backside thinned and polished samples.

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Shimadzu opens Solution Center at North American headquarters

Published: February 24, 2014

Shimadzu Scientific Instruments , Columbia, Md., has opened a new 4100-square-foot Solution Center in Columbia.

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Oxford Instruments acquires Andor

Published: February 24, 2014

Oxford Instruments, U.K., recently acquired Andor, South Windsor, Conn., a market leading supplier of high performance cameras, microscope systems, and software for the physical science and life science industries.

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Heraeus introduces thick print copper paste system for circuits 20 to 350 microns thick

Published: February 24, 2014

Heraeus Precious Metals, West Conshohocken, Pa., introduces a thick print copper paste system for power electronic applications where excellent reliability, thermal conductivity, and robust thermal cycling performance are required.

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SUSS MicroTec and IBM to collaborate on excimer technologies for semiconductor packaging

Published: February 23, 2014

SUSS MicroTec, Germany, announces the extension of a joint development agreement with the IBM Corporation to further develop, enhance, and propel the application of excimer laser technologies in the realm of advanced semiconductor packaging, including 3D systems integration.

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Semiconductor equipment industry posts $1.38 billion in orders

Published: February 22, 2014

SEMI, San Jose, Calif., reports that North America-based manufacturers of semiconductor equipment posted $1.38 billion in orders worldwide in December 2013 (three-month average basis) and a book-to-bill ratio of 1.02.

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Brewer Science introduces CNT inks without surfactants

Published: February 22, 2014

Brewer Science, Rolla, Mo., introduces CNTRENE 4010, the first aqueous, surfactant-free, ready-to-use semiconducting carbon nanotube inks for microelectronics and printed electronics applications.

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Mentor Graphics Veloce emulator targets verification of SoC integrated circuits

Published: February 22, 2014

Mentor Graphics Corp., Wilsonville, Ore., announces that the Shanghai ZhangJiang Institute has adopted the Veloce 2 emulation system for its research and development activities targeting the functional verification of System-on-Chip (SoC) integrated circuit designs.

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Leica Microsystems combines high-definition confocal microscopy and interferometry

Published: February 22, 2014

Leica Microsystems, Germany, launches the Leica DCM8 for nondestructive three-dimensional surface profiling.

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Ametek acquires VTI Instruments for its high-accuracy test/measurement solutions

Published: February 12, 2014

Ametek Inc., Berwyn, Pa., announces that it has acquired VTI Instruments, Irvine, Calif., which manufactures a wide range of signal conditioning and switching instruments, data acquisition solutions, and integrated test systems.

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