ISTFA 2026
San Antonio, Texas
October 4 – 8, 2026
Call for Abstracts
Deadline for Abstract Submissions: April 3, 2026.
Come to share your experiences and advance the industry and your career at the International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community. We invite you to submit your work for publication and to present it to the community in Pasadena, California, for the 52nd year of ISTFA.
Original, unpublished, and novel material is being solicited on testing, analysis, characterization, and metrology of electronic devices and systems from the nanoscale and upward.
Case studies, review papers, and non-commercial work from vendors are encouraged.
Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Abstracts should be a minimum of two pages long, including images and figures. References are required.
Technical Program Deadlines
| Abstract Submission Deadline: | Friday, April 3, 2026 | |
| Accept/Reject Notification to Authors: | Friday, May 1, 2026 | |
| Manuscript – First Draft Submitted by Author: | Friday, May 29, 2026 | |
| Manuscript – Reviewer Feedback to Authors: | Friday, June 12, 2026 | |
| Manuscript – Final PDF Deadline: | Friday, June 26, 2026 | |
| Presentation – First Draft from Authors: | Monday, July 13, 2026 | |
| Presentation – Reviewer Feedback to Authors, if needed: | Monday, July 27, 2026 | |
| Presentation – Final Approval by Reviewers/Mentors: | Monday, August 10, 2026 | |
| AV Chair Review Period | August 10 – August 30, 2026 | |
| AV Chair Review Deadline | Sunday, August 30, 2026 |
Original, unpublished abstracts are solicited in the following topic areas:
Focus Topics
- AI Applications for Failure Analysis
- Emerging FA Techniques and Concepts
- Die Level Fault Isolation
- Package Level Fault Isolation
- Packaging and Assembly
- System in Package and 3D Devices
- Wide Bandgap Power Devices (SiC, GaN, new materials)
- Boards and Systems
- FIB Circuit Edit
- Sample Preparation and Device De-processing
- FIB Sample Preparation
- Microscopy Analysis and Material Characterization
- Case Studies: Device Analysis
- Case Studies: FA Process and Workflows
- Product Yield, Test and Diagnostics
- Trusted Electronics
*To maintain the integrity of ISTFA, please obtain pre-approval to present your work at the conference before submitting your abstract. All costs associated with your participation will be at your expense (travel, housing, and registration fee).