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Plan Today to Attend and Participate at ISTFA 2026!
With a focus on both theoretical and practical applications, ISTFA 2026 promises to be an invaluable platform for professionals looking to enhance their expertise and stay at the forefront of microelectronics testing and failure analysis.
This premier gathering is your one-stop destination for leading-edge training, networking, and business opportunities across all market segments.
ISTFA 2026 (International Symposium for Testing and Failure Analysis)
Join us for the 52nd International Symposium for Testing and Failure Analysis (ISTFA) which is set to take place in San Antonio, Texas, from October 4-8, 2026. As the premier event for the microelectronics failure analysis community, ISTFA brings together leading experts, industry professionals, and researchers to share insights, innovations, and methodologies in the field. Attendees will engage in a comprehensive program that includes keynote presentations, technical sessions, workshops, and networking opportunities, all designed to foster collaboration and knowledge exchange.
ISTFA 2025 WINNERS
2025 Best Paper (First Place)
Towards in situ failure analysis of multi-layer ceramic capacitors using x-ray nano-laminography
Dr. Till Dreier1, Dr. Jenny Romell2, Dr. Julius Hållstedt3
Session: System in Package and 3D Devices
Presenting Author: Dr. Till Dreier, Excillum AB
2025 Outstanding Paper (Second Place)
Advancement Towards FIB Active Auto Thinning (AAT) Process
Dr. Sang Hoon Lee, PhD1, Dr. Xue Rui, PhD1, Dr. Ning Lu, PhD1, Mr. John Pittman1, Dr. Qiang Jin, PhD1, Mr. Joel Lebret1, Mr. Robert Gifford1, Mr. Tyler Lenzi1, Mr. Jaroslav Stárek2, Mr. Viktor Švéda2, Mr. Lukáš Hübner2, Mr. Jakub Korgo2, Dr. Zhen Lian, PhD3, Mr. Gabriel Woodworth3, Mr. Davin Fast3 and Ms. Anne Kenslea3, 1Micron Technology, Boise, ID, 2Thermo Fisher Scientific, Brno, Jihomoravský kraj, Czech Republic, 3Thermo Fisher Scientific, Hillsboro, OR
Session: FIB Sample Preparation II
Presenting Author: Dr. Sang Hoon Lee, PhD, Micron Technology
2025 Best Poster (First Place)
Emerging FA Techniques and Concepts – Open Failure LiT Localization Using Radio Frequency and Amplitude Modulation
Mr. Khristopherson C. Cajucom and Mr. Win T. Tun, Failure Analysis, Analog Devices Inc San Jose, California, San Jose, CA
Presenting Author: Mr. Khristopherson C. Cajucom, Analog Devices Inc.
2025 Outstanding Poster (Second Place)
Microscopy Analysis and Material Characterization – ECCI imaging of epitaxial GaN with conventional FE-SEM
Ms. Hyun Hwa Kim1, Mr. Greg Johnson2 and Dr. Thomas Rodgers3, 1Electronics Sector, Carl Zeiss Microscopy, Oberkochen, Oberkochen, Germany, 2Electronics Sector, Carl Zeiss Microscopy, Poughkeepsie, OH, 3Electronics Sector, Carl Zeiss Microscopy, Oberkochen, NY, Germany
Presenting Author: Ms. Hyun Hwa Kim, Carl Zeiss Microscopy
2025 Video Contest Winner
ZEISS Crossbeam Automatic TEM Sample Preparation
Dr. Heiko Stegmann, Business Sector Electronics, Carl Zeiss Microscopy GmbH, Oberkochen, Germany
2025 Student Poster Contest Winner
First Place Winner
Deposit-Induced Corrosion of a Ni-based Superalloy
Billy Li, Department of Chemical and Materials Engineering, California State Polytechnic University, Pomona, Pomona, CA
Second Place Winner
Pack Aluminizing of Selected Austenitic Stainless Steels
Jocasta Do, Department of Chemical and Materials Engineering, California State Polytechnic University, Pomona, Pomona, CA