Technical Program

Topics for the 2026 conference will include:

• AI Applications for Failure Analysis
• Emerging FA Techniques and Concepts
• Die Level Fault Isolation
• Package Level Fault Isolation
• Packaging and Assembly
• System in Package and 3D Devices
• Wide Bandgap Power Devices (SiC, GaN, new materials)
• Boards and Systems
• FIB Circuit Edit
• Sample Preparation and Device De-processing
• FIB Sample Preparation
• Microscopy Analysis and Material Characterization
• Case Studies: Device Analysis 
• Case Studies: FA Process and Workflows
• Product Yield, Test and Diagnostics
• Trusted Electronics