{"id":5477,"date":"2013-10-02T18:10:37","date_gmt":"2013-10-02T12:40:37","guid":{"rendered":"http:\/\/www.asminternational.org\/edfa-2\/"},"modified":"2025-10-21T15:55:03","modified_gmt":"2025-10-21T19:55:03","slug":"edfa-enews","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/asm-news\/newsletters\/edfa-enews\/","title":{"rendered":"EDFA eNews"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"5477\" class=\"elementor elementor-5477\" data-elementor-post-type=\"page\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-741622db elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"741622db\" data-element_type=\"section\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-25218355\" data-id=\"25218355\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-132ea130 elementor-widget elementor-widget-text-editor\" data-id=\"132ea130\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<h2>EDFA eNews<img decoding=\"async\" class=\"alignright\" style=\"float: right; margin-left: 15px; margin-right: 15px; width: 275px; height: 583px;\" src=\"\/wp-content\/uploads\/files\/10180\/EDFA Screenshot.png\" \/><\/h2><p><strong><span style=\"color: #000080;\">The\u00a0monthly newsletter from the Electronic Device Failure Analysis\u00a0Society (EDFAS).<\/span>\u00a0<\/strong><\/p><p>EDFA eNews is the monthly newsletter from ASM International and EDFAS\u00a0which covers the latest news from the failure analysis industry, developments in\u00a0products and equipment, event information, and more. The audience of EDFA\u00a0eNews consists of over 4,500 EDFAS members and other subscribers who want\u00a0product information on failure analysis equipment and services.<\/p><p>Interested in advertising in EDFA eNews? There are three sponsorship opportunities available\u00a0<a href=\"\/advertise\/\" target=\"_blank\" rel=\"noopener\"><strong>view our Media kit<\/strong><\/a> to learn more about these advertising opportunities or contact <a href=\"mailto:kelly.johanns@asminternational.org\">Kelly \u201cKJ\u201d Johanns<\/a>, ASM Business Development Manager.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>EDFA eNews The\u00a0monthly newsletter from the Electronic Device Failure Analysis\u00a0Society (EDFAS).\u00a0 EDFA eNews is the monthly newsletter from ASM International and EDFAS\u00a0which covers the latest news from the failure analysis industry, developments in\u00a0products and equipment, event information, and more. The audience of EDFA\u00a0eNews consists of over 4,500 EDFAS members and other subscribers who want\u00a0product information [&hellip;]<\/p>\n","protected":false},"author":63116,"featured_media":0,"parent":5632,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_lmt_disableupdate":"no","_lmt_disable":"","footnotes":""},"page_tag":[],"class_list":["post-5477","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.4 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>EDFA eNews - ASM International<\/title>\n<meta name=\"description\" content=\"Subscribe to the monthly electronic device failure analysis newsletter for the latest relevant information.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/asm-news\/newsletters\/edfa-enews\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"EDFA eNews - ASM International\" \/>\n<meta property=\"og:description\" content=\"Subscribe to the monthly electronic device failure analysis newsletter for the latest relevant information.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/asm-news\/newsletters\/edfa-enews\/\" \/>\n<meta property=\"og:site_name\" content=\"ASM International\" \/>\n<meta property=\"article:modified_time\" content=\"2025-10-21T19:55:03+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.asminternational.org\/asm-news\/newsletters\/edfa-enews\/\",\"url\":\"https:\/\/www.asminternational.org\/asm-news\/newsletters\/edfa-enews\/\",\"name\":\"EDFA eNews - ASM International\",\"isPartOf\":{\"@id\":\"https:\/\/www.asminternational.org\/#website\"},\"datePublished\":\"2013-10-02T12:40:37+00:00\",\"dateModified\":\"2025-10-21T19:55:03+00:00\",\"description\":\"Subscribe to the monthly electronic device failure analysis newsletter for the latest relevant information.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.asminternational.org\/asm-news\/newsletters\/edfa-enews\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.asminternational.org\/asm-news\/newsletters\/edfa-enews\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.asminternational.org\/asm-news\/newsletters\/edfa-enews\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"News, Magazines &amp; 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