{"id":5216,"date":"2015-05-06T13:33:44","date_gmt":"2015-05-06T08:03:44","guid":{"rendered":"http:\/\/www.asminternational.org\/edfa-member-access-digital-edition\/"},"modified":"2026-02-25T09:07:05","modified_gmt":"2026-02-25T14:07:05","slug":"edfa","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/asm-news\/magazines\/edfa\/","title":{"rendered":"EDFA"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"5216\" class=\"elementor elementor-5216\" data-elementor-post-type=\"page\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-6bb842af elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"6bb842af\" data-element_type=\"section\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-59c67f8b\" data-id=\"59c67f8b\" data-element_type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-42989bfd elementor-widget elementor-widget-text-editor\" data-id=\"42989bfd\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div><img fetchpriority=\"high\" decoding=\"async\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2023\/08\/EDFA-Aug-2023_Cover-300x238.jpg\" alt=\"\" width=\"300\" height=\"238\"><\/div>\n<div data-analytics-asset-id=\"6058819\" data-analytics-asset-title=\"EDFA\" data-analytics-asset-type=\"web-content\">\n<h2>Electronic Device Failure Analysis (EDFA)<\/h2>\n<p>Electronic Device Failure Analysis\u2122 (EDFA\u2122) is a high demand quarterly technical resource for the modern failure analysis professional.&nbsp;Published in both print and digital versions, each issue covers:<\/p>\n<ul style=\"margin-left: 40px\">\n<li>Contributed technical articles that cover everything from operations to techniques<\/li>\n<li>Insight into trends in the microelectronics FA industry, to keep you up-to-date<\/li>\n<li>New product announcements<\/li>\n<li>Recognition of outstanding contributions to the field of FA<\/li>\n<li>Looking to update some skills?&nbsp; The Training Calendar provides an easy way to know what courses are coming up in the months ahead.<\/li>\n<li>News of the Electronic Device Failure Analysis Society.<\/li>\n<li>Guest Columns provide that vital perspective into other FA<\/li>\n<\/ul>\n<p><span style=\"font-size: 16px\">All EDFAS members receive free access to the EDFA Magazine Digital Edition and <a href=\"https:\/\/dl.asminternational.org\/edfa-tech\">EDFA Technical Articles<\/a> as a membership&nbsp;benefit. <\/span><\/p>\n<p><span style=\"font-size: 16px\">If you’d like to purchase a subscription to EDFA magazine, please contact us at <a href=\"mailto:memberservicecenter@asminternational.org\" target=\"_blank\" rel=\"noopener\">memberservicecenter@asminternational.org<\/a> or by phone at 440.462.0292.&nbsp;<\/span><\/p>\n<p><a style=\"padding: 10px\" href=\"\/wp-content\/uploads\/2022\/02\/Author-Guidelines_2018.pdf\" target=\"_blank\" rel=\"noopener\">EDFA Author Guidelines<\/a> (pdf)<\/p>\n<p><a style=\"padding: 10px\" href=\"\/wp-content\/uploads\/2022\/02\/Guest-Editorial-Columnist-Guidelines_2018.pdf\" target=\"_blank\" rel=\"noopener\">EDFA Guest Editorial &amp; Columnist Guidelines<\/a> (pdf)<\/p>\n<p><a style=\"padding: 10px\" href=\"\/wp-content\/uploads\/2023\/01\/EDFA_Feb22_3till10-1.pdf\" target=\"_blank\" rel=\"noopener\">EDFA Sample Article<\/a> (pdf)<\/p>\n<p><span style=\"font-family: Helvetica, Arial, sans-serif;font-size: 15px\">Interested in advertising in <em>EDFAS&nbsp;<\/em>Magazine? There are many opportunities available!&nbsp;View our <a href=\"\/advertise\/\">Media Kit<\/a><em>&nbsp;<\/em>to learn more about these advertising opportunities, or contact <a href=\"mailto:kelly.johanns@asminternational.org\">Kelly \u201cKJ\u201d Johanns<\/a>, ASM Business Development Manager.&nbsp;<\/span><\/p>\n<p><span style=\"font-family: Helvetica, Arial, sans-serif;font-size: 15px\">&nbsp;<\/span><\/p>\n<hr>\n<p><strong>EDFA Editorial Board<\/strong><\/p>\n<p><a href=\"mailto:nicholas.antoniou@kla.com\" target=\"_blank\" rel=\"noopener\">Nicholas Antoniou,<\/a>&nbsp;KLA, Milpitas, CA, USA<br>Felix Beaudoin, Immediate Past Chair, GlobalFoundries, Malta, NY, USA<br>Navid Asadi, University of Florida, Gainesville, FL, USA<br>Guillaume Bascoul, CNES-French Space Agency, Toulouse, France<br>Mike Bruce, Past Chair, Independent Consultant, Austin, TX, USA<br>Jiann Min Chin, AMD Singapore, Singapore<br>Michael DiBattista, Varioscale Inc., San Marcos, CA, USA<br>Rosine Coq Germanicus, Universite de Caen Normandie, France<br>Szu Huat Goh, Qualcomm, Singapore<br>Jason Holm, NIST, Boulder, CO, USA<br>Ted Kolasa, Northrop Grumman Space Systems, Scottsdale, AZ, USA<br>Joy Liao, NVIDIA, San Jose, CA, USA<br>Rose Ring, Past Chair, NenoVision, Czech Republic<br>Tom Schamp, E-Space, Dallas, TX, USA<br>David Su, Yi-Xiang Investment Company, Hsinchu City, Taiwan<br>Martin Versen, University of Applied Sciences Rosenheim, Germany<br>Joanne Miller, Senior Editor, ASM International, Materials Park, OH, USA<br>Vicki Burt, Managing Editor and ASM Staff Liaison, ASM International, Materials Park, OH, USA<\/p>\n<p><strong>EDFA Founding Editors<\/strong><\/p>\n<p>Ed Cole, Sandia National Laboratories, Albuquerque, NM, USA<br>Larry Wagner, LWSN Consulting, Plano, TX, USA<\/p>\n<\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t<div class=\"elementor-element elementor-element-88a9e24 e-flex e-con-boxed e-con e-parent\" data-id=\"88a9e24\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-bf16b0b elementor-widget elementor-widget-spacer\" data-id=\"bf16b0b\" data-element_type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-6bc23e1 e-flex e-con-boxed e-con e-parent\" data-id=\"6bc23e1\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-92f739d elementor-widget elementor-widget-shortcode\" data-id=\"92f739d\" data-element_type=\"widget\" data-widget_type=\"shortcode.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-shortcode\"><div class=\"facetwp-facet facetwp-facet-result_count facetwp-type-pager\" data-name=\"result_count\" data-type=\"pager\"><\/div>\n<div class=\"facetwp-facet facetwp-facet-pagination facetwp-type-pager\" data-name=\"pagination\" data-type=\"pager\"><\/div>\n<div class=\"facetwp-template\" data-name=\"magazines_listing_edfa\"><div class=\"fwpl-layout el-3nlyri\"><div class=\"fwpl-result r1\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2026\/01\/EDFA_February-2026_Cover_De-web-150x150.webp\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2026\/01\/EDFA_February-2026_Cover_De-web-150x150.webp 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2026\/01\/EDFA_February-2026_Cover_De-web-100x100.webp 100w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2026\/01\/EDFA_February-2026_Cover_De-web-32x32.webp 32w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-28-issue-1-february-2026\/\">Electronic Device Failure Analysis, Volume 28, Issue 1, February 2026<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The February 2026 issue of Electronic Device Failure Analysis includes: A Step Toward Automation in Failure Analysis; Advanced FA using In-Situ AFM in FIB-SEM; Enhancing Soft Defect Localization; Highlights from ISTFA 2025; and more.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r2\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/10\/EDFA-November-2025-Cover_DE-web-150x150.webp\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/10\/EDFA-November-2025-Cover_DE-web-150x150.webp 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/10\/EDFA-November-2025-Cover_DE-web-100x100.webp 100w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/10\/EDFA-November-2025-Cover_DE-web-32x32.webp 32w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-27-issue-4-november-2025\/\">Electronic Device Failure Analysis, Volume 27, Issue 4, November 2025<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The November 2025 issue of Electronic Device Failure Analysis includes: Chiplet Architectures for Scalable Integration; Thermal Approaches to Fault Isolation in 3D Structures; Avoiding Device Degradation through Nanoprobing; Failure Analysis Chatbot with Retrieval-Augmented Generation; and more.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r3\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/07\/EDFA-August-2025_Cover_DE-web-150x150.webp\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/07\/EDFA-August-2025_Cover_DE-web-150x150.webp 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/07\/EDFA-August-2025_Cover_DE-web-100x100.webp 100w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/07\/EDFA-August-2025_Cover_DE-web-32x32.webp 32w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-27-issue-3-august-2025\/\">Electronic Device Failure Analysis, Volume 27, Issue 3, August 2025<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The August 2025 issue of Electronic Device Failure Analysis includes: Electrical Resistivity and Residual Stress in Sputtered ITO Films; CAD Methods for Cross-Domain FA in Advanced SIP Architectures; Characterization of Yield-Killing Defects in Micro-LED Wafers; Systematically Defocusing the Ion Beam for FIB Workflows; and more.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r4\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/04\/EDFA-May-2025_Cover_DE-web-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/04\/EDFA-May-2025_Cover_DE-web-150x150.png 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/04\/EDFA-May-2025_Cover_DE-web-100x100.png 100w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/04\/EDFA-May-2025_Cover_DE-web-32x32.png 32w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-27-issue-2-may-2025\/\">Electronic Device Failure Analysis, Volume 27, Issue 2, May 2025<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The May 2025 issue of Electronic Device Failure Analysis includes: Background and History of the U.S. Chips Act; Silicon Photonic FA using Near Infrared Microscopy; An Ion Microscope for Imaging and SIMS Nanoanalytics; Solder Joints under Varying Temperatures and Salinities; and more.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r5\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/01\/EDFA_February-2025_Cover_DE-web-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/01\/EDFA_February-2025_Cover_DE-web-150x150.png 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/01\/EDFA_February-2025_Cover_DE-web-100x100.png 100w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2025\/01\/EDFA_February-2025_Cover_DE-web-32x32.png 32w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-27-issue-1-february-2025\/\">Electronic Device Failure Analysis, Volume 27, Issue 1, February 2025<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The February 2025 issue of Electronic Device Failure Analysis includes: Backside Delayering of 10 nm Node Integrated Circuits; Low Frequency Noise Spectroscopy; Quantum Diamond Microscopy for Failure Analysis; Highlights from ISTFA 2024; and more.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r6\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/10\/EDFA-November-2024_Slanted-Cover_DE-web-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/10\/EDFA-November-2024_Slanted-Cover_DE-web-150x150.png 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/10\/EDFA-November-2024_Slanted-Cover_DE-web-100x100.png 100w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-26-issue-4-november-2024\/\">Electronic Device Failure Analysis, Volume 26, Issue 4, November 2024<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The November 2024 issue of Electronic Device Failure Analysis includes: Celebrating 50 Years of ISTFA; Four-dimensional Scanning Transmission Electron Microscopy: Part III, Ptychography; Nondestructive 3D X-ray Microscopy Speeds Throughput; Specimen Thinning by Argon Ion Beam Milling; TEM Samples with PFIB and STEM EBIC; and more.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r7\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/07\/EDFA-August-2024_Cover_DE-web-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/07\/EDFA-August-2024_Cover_DE-web-150x150.png 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/07\/EDFA-August-2024_Cover_DE-web-100x100.png 100w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-26-issue-3-august-2024\/\">Electronic Device Failure Analysis, Volume 26, Issue 3, August 2024<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The August 2024 issue of Electronic Device Failure Analysis includes: Defect Detection of BGA Solder using Deep Learning, Advanced IC Packages for X-ray Inspection, Wire Bonding in Power Microelectronic Devices, 50th Anniversary: ISTFA 2024 Preview, and more.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r8\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/04\/EDFA-May-2024_Slanted-Cover-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/04\/EDFA-May-2024_Slanted-Cover-150x150.png 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/04\/EDFA-May-2024_Slanted-Cover-500x500.png 500w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/04\/EDFA-May-2024_Slanted-Cover-600x600.png 600w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/04\/EDFA-May-2024_Slanted-Cover-300x300.png 300w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/04\/EDFA-May-2024_Slanted-Cover-100x100.png 100w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-26-issue-2-may-2024\/\">Electronic Device Failure Analysis, Volume 26, Issue 2, May 2024<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The May 2024 issue of Electronic Device Failure Analysis includes: SThM for Localizing and Monitoring Defects, MicroStructural Hierarchy Descriptor for MFA, Electro-Thermal Simulation and Reliability of a BGA, and Differential Laser Voltage Probe Overview.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r9\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/01\/EDFA_February-2024_Cover_DE-web_04-24-2024-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/01\/EDFA_February-2024_Cover_DE-web_04-24-2024-150x150.png 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/01\/EDFA_February-2024_Cover_DE-web_04-24-2024-300x300.png 300w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/01\/EDFA_February-2024_Cover_DE-web_04-24-2024-768x768.png 768w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/01\/EDFA_February-2024_Cover_DE-web_04-24-2024-500x500.png 500w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/01\/EDFA_February-2024_Cover_DE-web_04-24-2024-600x600.png 600w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/01\/EDFA_February-2024_Cover_DE-web_04-24-2024-100x100.png 100w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2024\/01\/EDFA_February-2024_Cover_DE-web_04-24-2024.png 932w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-26-issue-1-february-2024\/\">Electronic Device Failure Analysis, Volume 26, Issue 1, February 2024<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">The February 2024 issue of Electronic Device Failure Analysis includes: Four-Dimensional STEM: Part II: Applications; Advanced Characterization using Atom Probe Tomography; Thinning and Polishing Highly Warped Die: Part III; ISTFA Wrap Up; and Panel &amp; User Group Summary.<\/div><\/div><\/div><\/div><div class=\"fwpl-result r10\"><div class=\"fwpl-row el-pj32xg7\"><div class=\"fwpl-col fwpl-col el-t27m1m\"><div class=\"fwpl-item el-amxz9g\"><span class=\"contentIcon bookmark\"><\/span><\/div><\/div><\/div><div class=\"fwpl-row el-px9o1a\"><div class=\"fwpl-col fwpl-col el-0f13hua\"><div class=\"fwpl-item el-ql26l3 post-image\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2023\/10\/EDFA_November-2023_Slanted-Cover_for-DE-website-150x150.png\" class=\"attachment-thumbnail size-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2023\/10\/EDFA_November-2023_Slanted-Cover_for-DE-website-150x150.png 150w, https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2023\/10\/EDFA_November-2023_Slanted-Cover_for-DE-website-100x100.png 100w\" sizes=\"(max-width: 150px) 100vw, 150px\" \/><\/div><\/div><div class=\"fwpl-col fwpl-col el-t5lw9\"><div class=\"fwpl-item el-40alu post-link\"><a href=\"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-25-issue-4-november-2023-asm-international\/\">Electronic Device Failure Analysis, Volume 25, Issue 4, November 2023<\/a><\/div><div class=\"fwpl-item el-f70p7 my-listing-excerpt\">November 2023 Issue of Electronic Device Failure Analysis, a quarterly publication providing a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers.<\/div><\/div><\/div><\/div><\/div>\n<style>\n.fwpl-layout, .fwpl-row {\n    display: grid;\n}\n.fwpl-layout.el-3nlyri {\n    grid-template-columns: repeat(1, 1fr);\n    grid-gap: 10px;\n}\n.fwpl-btn {\n    text-decoration: 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you up-to-date New [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":5633,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_lmt_disableupdate":"no","_lmt_disable":"","footnotes":""},"page_tag":[],"class_list":["post-5216","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.4 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>EDFA - ASM International<\/title>\n<meta name=\"description\" content=\"Get the quarterly technical resource on Electronic Device Failure Analysis (EDFA) to stay up to date on the latest industry news.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/asm-news\/magazines\/edfa\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta 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