{"id":1133712,"date":"2025-02-28T14:33:13","date_gmt":"2025-02-28T19:33:13","guid":{"rendered":"https:\/\/www.asminternational.org\/?page_id=1133712"},"modified":"2026-01-12T16:16:49","modified_gmt":"2026-01-12T21:16:49","slug":"bookstore-microelectronics-failure-analysis","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/bookstore-microelectronics-failure-analysis\/","title":{"rendered":"Bookstore | Microelectronics Failure Analysis"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"1133712\" class=\"elementor elementor-1133712\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-069fe98 e-con-full e-flex e-con e-parent\" data-id=\"069fe98\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-67ad768 elementor-widget elementor-widget-heading\" data-id=\"67ad768\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Microelectronics Failure Analysis<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-63dcc94 elementor-widget elementor-widget-heading\" data-id=\"63dcc94\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">Explore ASM resources on failure analysis tools and techniques for microelectronic components<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5418eb3 e-flex e-con-boxed e-con e-parent\" data-id=\"5418eb3\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d82e6e4 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"d82e6e4\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-feabaa8 e-flex e-con-boxed e-con e-parent\" data-id=\"feabaa8\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-99717e4 e-con-full e-flex e-con e-child\" data-id=\"99717e4\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-dc8d48f elementor-widget elementor-widget-image\" data-id=\"dc8d48f\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2023\/09\/product-image-453.jpg\" title=\"\" alt=\"Microelectronics Failure Analysis Desk Reference, Seventh Edition\" loading=\"lazy\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-cb46110 e-con-full e-flex e-con e-child\" data-id=\"cb46110\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5a92336 elementor-widget elementor-widget-text-editor\" data-id=\"5a92336\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<h6><strong>Microelectronics Failure Analysis Desk Reference, Seventh Edition<\/strong><\/h6><p>The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.<\/p><p><strong>Print Edition:<\/strong> $190 ASM Members | $250 Non-Members<\/p><p><strong>Digital Library Subscription:<\/strong> $62.02 ASM Members | $79 Non-Members<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-cf860ce e-con-full e-flex e-con e-child\" data-id=\"cf860ce\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-42cb838 elementor-align-justify elementor-widget elementor-widget-button\" data-id=\"42cb838\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/www.asminternational.org\/results\/-\/journal_content\/56\/38278573\/PUBLICATION\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<i aria-hidden=\"true\" class=\"fas fa-book-open\"><\/i>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Print Copy<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-28e1614 elementor-align-justify elementor-widget elementor-widget-button\" data-id=\"28e1614\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/dl.asminternational.org\/technical-books\/monograph\/87\/Microelectronics-Failure-AnalysisDesk-Reference\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<i aria-hidden=\"true\" class=\"fas fa-desktop\"><\/i>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Digital Library<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b022b74 e-flex e-con-boxed e-con e-parent\" data-id=\"b022b74\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6b28195 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"6b28195\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-06cc524 e-flex e-con-boxed e-con e-parent\" data-id=\"06cc524\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-8bebc81 e-con-full e-flex e-con e-child\" data-id=\"8bebc81\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-793da7e elementor-widget elementor-widget-image\" data-id=\"793da7e\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/asm.silverchair-cdn.com\/asm\/content_public\/books\/110\/book\/5\/m_asm.tb.stemsem.cover.png?Expires=1742502281&#038;Signature=I6ybdR-NNWQDpXf1LDO5f-TbnptfiE3QXVunClKTuW36B4W5NBfecwqBh7NxLkopHIfGZrAtL~2lv0fcEUjL8DdAFHEaShZYhmrqts1c0qoy~w9pYf-OxuR6XHU-Whgwypvqne-Y33Y~SPdjUDwKQ4r775LSIiNBRslIJlz3KZ8bxzhBhACpoCp8DxWR4j7lvJpkuc4V1xx1MQwzL9smowOaDIac8KQURtoOQt1rjsFVCHBWNo1utb-YBOWUIOOQqA0SRVU1P0gJgthHYvx6qXYxoPTnZF5GsdLKso~ZVeVcNOHTBVbfpSm6IofHsZcY7lSsEsmAsHrzzIn1xUT1IQ__&#038;Key-Pair-Id=APKAIE5G5CRDK6RD3PGA\" title=\"\" alt=\"STEM-in-SEM: Introduction to Scanning Transmission Electron Microscopy for Microelectronics Failure Analysis\" loading=\"lazy\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-bb40809 e-con-full e-flex e-con e-child\" data-id=\"bb40809\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1b0ce1b elementor-widget elementor-widget-text-editor\" data-id=\"1b0ce1b\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<h6><strong>STEM-in-SEM: Introduction to Scanning Transmission Electron Microscopy for Microelectronics Failure Analysis<\/strong><\/h6><p>Scanning electron microscopes (SEMs) are an essential tool for analyzing microelectronic failures. They reveal features over multiple length scales and can be used, with appropriate detectors, to examine grain size and orientation, compositional distributions, atomic contrast, and more.<\/p><p><strong>Digital Library Subscription:<\/strong> $10 \/ year | Free to EDFAS Members<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-fdbcdcb e-con-full e-flex e-con e-child\" data-id=\"fdbcdcb\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e45755f elementor-align-justify elementor-widget elementor-widget-button\" data-id=\"e45755f\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/dl.asminternational.org\/technical-books\/edited-volume\/110\/STEM-in-SEMIntroduction-to-Scanning-Transmission\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<i aria-hidden=\"true\" class=\"fas fa-desktop\"><\/i>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Digital Library<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-4b1f6c0 e-flex e-con-boxed e-con e-parent\" data-id=\"4b1f6c0\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5ece48e elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"5ece48e\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9afad2c e-flex e-con-boxed e-con e-parent\" data-id=\"9afad2c\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-6b26cc6 e-con-full e-flex e-con e-child\" data-id=\"6b26cc6\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a5b87ea elementor-widget elementor-widget-image\" data-id=\"a5b87ea\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2023\/09\/product-image-492.jpg\" title=\"\" alt=\"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis\" loading=\"lazy\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-369883f e-con-full e-flex e-con e-child\" data-id=\"369883f\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3b591b5 elementor-widget elementor-widget-text-editor\" data-id=\"3b591b5\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<h6><strong>ISTFA\u2122 2021 Proceedings from the 47th International Symposium for Testing and Failure Analysis<\/strong><\/h6><p>The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; scanning probe analysis; hardware attacks, security, and reverse engineering; microscopy and material characterization; nanoprobing and electrical characterization; and more.<\/p><p><strong>Print Edition:<\/strong> $125 ASM Members | $185 Non-Members<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a38b575 e-con-full e-flex e-con e-child\" data-id=\"a38b575\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3882df4 elementor-align-justify elementor-widget elementor-widget-button\" data-id=\"3882df4\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/www.asminternational.org\/wkcl-shop\/conference-papers\/istfa-2021-conference-proceedings-from-the-47th-international-symposium-for-testing-and-failure-analysis\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<i aria-hidden=\"true\" class=\"fas fa-book-open\"><\/i>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Print Copy<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f1a2dd0 e-flex e-con-boxed e-con e-parent\" data-id=\"f1a2dd0\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-058072a elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"058072a\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b9bd25e e-flex e-con-boxed e-con e-parent\" data-id=\"b9bd25e\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-089cb49 e-con-full e-flex e-con e-child\" data-id=\"089cb49\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-31fead0 elementor-widget elementor-widget-image\" data-id=\"31fead0\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/2023\/09\/product-image-477.jpg\" title=\"\" alt=\"ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis\" loading=\"lazy\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9dfc8d4 e-con-full e-flex e-con e-child\" data-id=\"9dfc8d4\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d47250f elementor-widget elementor-widget-text-editor\" data-id=\"d47250f\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<h6><strong>ISTFA\u2122 2020 Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis<\/strong><\/h6><p>The International Symposium for Testing and Failure Analysis is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques.<\/p><p><strong>Print Edition:<\/strong> $140 ASM Members | $185 Non-Members<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-ed684f4 e-con-full e-flex e-con e-child\" data-id=\"ed684f4\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-eac0d9a elementor-align-justify elementor-widget elementor-widget-button\" data-id=\"eac0d9a\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/www.asminternational.org\/results\/-\/journal_content\/56\/43818924\/PUBLICATION\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<i aria-hidden=\"true\" class=\"fas fa-book-open\"><\/i>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Print Copy<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-183c79f e-flex e-con-boxed e-con e-parent\" data-id=\"183c79f\" data-element_type=\"container\" data-settings=\"{&quot;jet_parallax_layout_list&quot;:[]}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5248770 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"5248770\" data-element_type=\"widget\" data-widget_type=\"divider.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Microelectronics Failure Analysis Explore ASM resources on failure analysis tools and techniques for microelectronic components Microelectronics Failure Analysis Desk Reference, Seventh Edition The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify [&hellip;]<\/p>\n","protected":false},"author":64471,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_lmt_disableupdate":"no","_lmt_disable":"","footnotes":""},"page_tag":[],"class_list":["post-1133712","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.4 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Bookstore | Microelectronics Failure Analysis - ASM International<\/title>\n<meta name=\"description\" content=\"Explore ASM resources on failure analysis tools and techniques for microelectronic components. 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