{"id":1132677,"date":"2025-01-30T16:21:51","date_gmt":"2025-01-30T21:21:51","guid":{"rendered":"https:\/\/www.asminternational.org\/?post_type=magazine&p=1132677"},"modified":"2025-01-30T16:21:51","modified_gmt":"2025-01-30T21:21:51","slug":"electronic-device-failure-analysis-volume-27-issue-1-february-2025","status":"publish","type":"magazine","link":"https:\/\/www.asminternational.org\/magazine\/electronic-device-failure-analysis-volume-27-issue-1-february-2025\/","title":{"rendered":"Electronic Device Failure Analysis, Volume 27, Issue 1, February 2025"},"content":{"rendered":"

The February 2025 issue of Electronic Device Failure Analysis<\/em> includes: Backside Delayering of 10 nm Node Integrated Circuits; Low Frequency Noise Spectroscopy; Quantum Diamond Microscopy for Failure Analysis; Highlights from ISTFA 2024; <\/em>and more.<\/p>\n

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View Now<\/span><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

The February 2025 issue of Electronic Device Failure Analysis includes: Backside Delayering of 10 nm Node Integrated Circuits; Low Frequency Noise Spectroscopy; Quantum Diamond Microscopy for Failure Analysis; Highlights from ISTFA 2024; and more.<\/p>\n","protected":false},"author":63161,"featured_media":1132679,"template":"","meta":{"_acf_changed":false,"_lmt_disableupdate":"no","_lmt_disable":""},"metadata":[589,521,418],"class_list":["post-1132677","magazine","type-magazine","status-publish","has-post-thumbnail","hentry","metadata-electronics-gc10486","metadata-failure-analysis-gc10411","metadata-magazine-articles-gc1741360"],"yoast_head":"\nElectronic Device Failure Analysis, Volume 27, Issue 1, February 2025 - ASM International<\/title>\n<meta name=\"description\" content=\"The February 2025 issue of Electronic Device Failure Analysis includes: Backside Delayering of 10 nm Node Integrated Circuits; Low Frequency Noise Spectroscopy; Quantum Diamond Microscopy for Failure Analysis; 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