Bill Morrow
MEFAS Inc, Lake Forest, California, USA
EOS damaged thin film resistor on a GaAs substrate.
2nd Place:
Ramesh Kuchibhatla
Semiconductor Insights, Kanata, Ontario, Canada
Optical Topographical view of a
laser end seen through the lens.
3rd Place:
Vincent Liew
Micron Semi Asia, Singapore
Passivation delamination
Category II: Black and White Images
1st Place:
Zachary Gemmill
National Semiconductor, Santa Clara, California, USA
“Hardened Artery.” FIB cross-section of a copper wire showing oxidation layers after thermal stress. (secondary electron image taken with the ion beam)
2nd Place:
Choong Pin Joey Phua
AMD, Singapore
This shows transistors of an SOI device.
The chip is deprocessed from the
backside with bulk silicon, box and active silicon removed, revealing the
channel, nitride spacer and the COSI.
This is useful for salicide defect
inspection from the backside of the die.
3rd Place:
Sue Brown
Semiconductor Insights, Kanata, Ontario, Canada
SEM view of dendritic growth on surface of an IC
Category III: False Color Images
1st Place:
Tsan-Cheng Chuang
Cha-Ming Shen
Jon C. Lee
TSMC, Tainan, Taiwan, ROC
SCM image (Scanning Capacitance Microscope) showed that P+ doping concentration/distribution abnormal was revealed at VDD node.
2nd Place:
Ramesh Kuchibhatla
Semiconductor Insights, Kanata, Ontario, Canada
Optical Image of a III-V, LaserDiode
created using Linear Local Level
Equilization Technique.