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2007 Photo Contest Winners

Congratulations to the 2007 winners!
 Category I: Color Images
1st Place:

Becky L. Thompson
Intel Corp

It is a Flip Chip bump crack with fluorescent dye

2nd Place:


Bill Morrow

MEFAS, Inc.

This is a differential interference contrast
(DIC) image of decapsulated part which
had popcorn delamination and
subsequent EOS from shorts. The
demarcation of the crack is visible with
EOS visible on the lower half which
is below the focal plane.
3rd Place: 

Sang Ah Kim

QRT Semiconductor

The photo is a copper dendrite growth on fuse boxes of a memory device after Highly Accelerated Temperature and Humidity
Stress Test.

 Category II: Black and White Images

1st Place:

Hoang-Yen To

Texas Instruments

This is SEM image with PVC and tilted 35 degrees. Device failed all addresses at Bit 34 of a 64-bit word, in all sectors of the flash. The logic component that has the leaky gate is the Enable signal of the buffer that
passes data from 64-bit Flash Bus of Bit34 to 32-bit Arm Bus.

2nd Place: 

Vassilios Danginis

SMSC

X-ray of an LED {This is an X-ray photo
of an LED. The sample was inspected
using 2D and 3D using an X-Tek
equipment and a CT imaging}

3rd Place:

Sue Brown

Semiconductor Insights

Dendrites on a bond wire.
 Category III: False Color Images

1st Place:

False Color Images
1st Place: Rafael Huerta and Zachary Gemmill

National Semiconductor

EBIC image of an analog device showing emitter leakage on an NPN transistor.

2nd Place:

Dr. Dan Sullivan

Novalux, Inc.

Tennis ball, Big Mac, Whopper, and Pac
Man. IR emission images of VECSEL
lasers. The line observed
are dark line defects.

3rd Place:

Damon Rachell

MEFAS Inc

“Poly Hotdogs”
The entry consists of an IR emissivity image of four poly strain gauges on a diaphragm viewed at 80ºC.  Each of the gauges shows variations in emissivity, indicating possible differences in the gauges’ attachment to the diaphragm or possible material variations within the gauges themselves.