Principles of Soldering

If you work with soldering processes or soldered components, Principles of Soldering will help you understand and solve practical engineering challenges.

Clearly written and well referenced, this book takes you from the fundamental characteristics of solders, fluxes, and joining environments to the impact these have in the selection and successful use of soldering processes. Priority is given to the fundamental principles that underlie this field of technology rather than recipes for making joints. Striking a balance between being unduly simplistic or overly mathematical in their approach, the authors provide the critical analysis that is missing from much of the literature on soldering. An entire section is devoted to the difficult art of fluxless soldering and includes strategies for devising successful processes. The final chapter is devoted to recent advances in soldering technology and covers a variety of topics including lead-free solders, flip-chip interconnection, diffusion soldering, amalgams as solders, composite solders and other “hot” areas of research.

Containing approximately 200 figures and 60 tables, this book updates and greatly expands the soldering content in the book Principles of Soldering and Brazing (1993) by the same authors. A companion volume, Principles of Brazing, is available.

About the Authors:

The authors received valuable feedback from readers of their book Principles of Soldering and Brazing, published by ASM International in 1993. The wide range of technical interests of these readers prompted the authors to completely revise and considerably expand the text into two companion volumes, one covering soldering and the other brazing. More than half the content in each volume is completely new material. This book provides information about soldering in a readily accessible and easy to assimilate form.

Giles Humpston took a first degree in Metallurgy at Brunel University in 1982, followed by a Ph.D. on the constitution of solder alloys in 1985. He has since been employed by several leading industrial companies, where he has been involved with determining alloy phase diagrams and developing processes and procedures for producing precise and high integrity soldered, brazed and diffusion bonded joints to a wide variety of metallic and non-metallic materials. His expertise extends to fine-pitch flip-chip, new materials development, and packaging and interconnection for electronics, RF and optical products. He is the cited inventor on over 45 patents, the author of more than 60 papers and recipient of six international awards for his work on soldering and brazing.

David M. Jacobson graduated in Physics from the University of Sussex in 1967 and obtained his doctorate in Materials Science there in 1972. Between 1972 and 1975 he lectured in Materials Engineering at the Ben Gurion University, Beer-Sheva, Israel, returning as Visiting Senior Lecturer in 1979-1980. Having gained experience in brazing development with Johnson Matthey Ltd., he extended his range of expertise to soldering at the Hirst Research Centre, GEC-Marconi Ltd, which he joined in 1980. Currently, he is holds the position of Senior Research Associate at the Centre for Rapid Design and Manufacture, Buckinghamshire Chilterns University College, in High Wycombe. He is the author of more than 80 scientific and technical publications in materials science and technology, over a dozen patents and has been awarded three prestigious awards for his work on brazing.