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Published: December 31, 2021
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; scanning probe analysis; hardware attacks, security, and reverse engineering; microscopy and material characterization; nanoprobing and electrical characterization; and more.
$185.00
Member Price: $125.00
Published: December 31, 2020
The International Symposium for Testing and Failure Analysis is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques.
$185.00
Member Price: $140.00
Published: October 31, 2016
The eighth in a series of conferences on the subject of materials for advanced plants, held every three years by EPRI.
$135.00
Member Price:
Published: January 31, 2020
The theme for the 2019 conference was Novel Computing Architectures. Papers include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
$167.00
Member Price:
Published: December 28, 2018
The theme for the November 2018 conference was "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
$167.00
Member Price: $125.00
Published: September 5, 2017
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
$167.00
Member Price: $125.00
Published: March 1, 2010
Conference proceedings covering topics including new boiler and steam turbine materials, high-temperature material behavior (creep, creep-fatigue, etc.), life management, fireside and steam-side corrosion, welding and fabrication, and field experience.
$187.00
Member Price: $135.00
Published: February 28, 2014
Conference proceedings covering the latest technology developments for fossil fuel power plants, including nickel-based alloys for advanced ultrasupercritical power plants, materials for turbines, oxidation and corrosion, welding and weld performance, new alloys concepts, and creep and general topics.
$187.00
Member Price: $135.00









