Industry News
Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.
- 1282 items found
SUSS MicroTec and IBM to collaborate on excimer technologies for semiconductor packaging
Published: February 23, 2014
SUSS MicroTec, Germany, announces the extension of a joint development agreement with the IBM Corporation to further develop, enhance, and propel the application of excimer laser technologies in the realm of advanced semiconductor packaging, including 3D systems integration.
Semiconductor equipment industry posts $1.38 billion in orders
Published: February 22, 2014
SEMI, San Jose, Calif., reports that North America-based manufacturers of semiconductor equipment posted $1.38 billion in orders worldwide in December 2013 (three-month average basis) and a book-to-bill ratio of 1.02.
Brewer Science introduces CNT inks without surfactants
Published: February 22, 2014
Brewer Science, Rolla, Mo., introduces CNTRENE 4010, the first aqueous, surfactant-free, ready-to-use semiconducting carbon nanotube inks for microelectronics and printed electronics applications.
Mentor Graphics Veloce emulator targets verification of SoC integrated circuits
Published: February 22, 2014
Mentor Graphics Corp., Wilsonville, Ore., announces that the Shanghai ZhangJiang Institute has adopted the Veloce 2 emulation system for its research and development activities targeting the functional verification of System-on-Chip (SoC) integrated circuit designs.
Leica Microsystems combines high-definition confocal microscopy and interferometry
Published: February 22, 2014
Leica Microsystems, Germany, launches the Leica DCM8 for nondestructive three-dimensional surface profiling.
Ametek acquires VTI Instruments for its high-accuracy test/measurement solutions
Published: February 12, 2014
Ametek Inc., Berwyn, Pa., announces that it has acquired VTI Instruments, Irvine, Calif., which manufactures a wide range of signal conditioning and switching instruments, data acquisition solutions, and integrated test systems.
Predicting new forms of insulating materials
Published: February 07, 2014
Topological insulators have been of great interest to physicists in recent years because of unusual properties that may provide insights into quantum physics.
ASM International debuts revamped website
Published: February 06, 2014
ASM International, Materials Park, Ohio, recently rolled out a major redesign of their company website.
Scanning Microwave Impedance Microscopy for nanoscale mapping of permittivity and conductivity
Published: January 21, 2014
Asylum Research, Santa Barbara, Calif., an Oxford Instruments company, has developed Scanning Microwave Impedance Microscopy (sMIM), an atomic force microscopy technique that enables nanoscale mapping of permittivity and conductivity.
Instrument measures silicon wafer thickness and TSV depths prior to grinding
Published: January 21, 2014
Lasertec U.S.A., San Jose, Calif., introduces the WASAVI Series BGM300. This instrument measures silicon wafer thicknesses and TSV depths prior to back grinding 3D semiconductor devices.
